TransSiP’s patent portfolio builds on a foundation of innovation in the area of More-than-Moore (MtM) technologies.
Using advanced 3D heterogeneous (active and passive) embedded system-in-package designs, TransSiP’s MtM technologies range from applications of micro-metamaterials in semiconductor packaging to breakthroughs in DC-DC conversion solutions for noise-sensitive systems/subsystems. These products and technologies offer the potential for significant increases in battery life and performance improvements in wearable/portable and IoT microsystems.
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Hong Kong based semiconductor company, involved in the design, manufacture of Embedded Flash MCU (microcontroller unit) and system-on-chip (SoC) Integrated Circuits (IC).