TransSiP’s patent portfolio builds on a foundation of innovation in the area of More-than-Moore (MtM) technologies.

Using advanced 3D heterogeneous (active and passive) embedded system-in-package designs, TransSiP’s MtM technologies range from applications of micro-metamaterials in semiconductor packaging to breakthroughs in DC-DC conversion solutions for noise-sensitive systems/subsystems. These products and technologies offer the potential for significant increases in battery life and performance improvements in wearable/portable and IoT microsystems.